Asic Engineer at Actalent

This role is primarily a people-management position (leading a worldwide R&D team, 3+ years management required, hiring/mentoring/retention responsibilities), mapped to 11-3021. However, the role also demands deep hands-on IC package design expertise, making 15-1299 (Computer Occupations, All Other) a plausible runner-up — IC package design engineering does not map cleanly to any standard BLS computer/software SOC.

The job title says 'Manager' but the posting is placed through Actalent (a staffing/consulting firm) on behalf of what appears to be Broadcom. The primary work location is stated as Broomfield, CO, with Fort Collins and San Jose mentioned as secondary onsite preferences; the CBSA reflects Broomfield (Denver-Aurora-Lakewood metro).

The 12+ years experience requirement is specifically tied to flip-chip BGA package design, not general engineering; it is captured as the years demanded on that skill and also as the overall years minimum since it is the stated overall role-level gate.

Management experience (3+ years) is a hard gate per the Essential Skills section but names no specific technology, so it is reflected in the overall years minimum context and the seniority assessment rather than as a named skill.

HBM, DDR5, SI/PI simulation, DFx, mechanical/thermal modeling, and automation scripting appear under 'Additional Skills & Qualifications,' which functions as a preferred/nice-to-have section.

SerDes, SI, PI, ASIC co-design, PCB layout, and project management are all listed under 'Essential Skills' and are treated as hard gates.

Ignored 4 non-technology phrase(s) as skills (responsibilities/concepts, not named tools): flip-chip BGA package design, ASIC package co-design, project management, mechanical/thermal modeling.